Electronics & power design
Analogue and switched-mode power stages, magnetics design, constant-current driver topologies, protection circuits, 4-layer PCB layout with DFM rules applied at layout time, not after.
What "done" means
A design is not finished until it can be manufactured, certified and serviced
Every development programme ends with an engineering pack that a production planner can execute: frozen bill of materials with approved vendor lists, tested firmware images with checksums, assembly drawings, test sequences, fixture definitions and a certification plan with named test scopes.
Because industrialisation happens in the same organisation, DFM and DFT findings arrive while the design is still open — not after tooling is cut. It is the single biggest reason our products reach certified shipment inside six months.
40+
Engineers
6
Design disciplines
100%
Designs handed with DFM review
Capabilities
Six engineering disciplines, one accountable team
Engage us for the whole product or for a single discipline that has to plug into your existing design.
Embedded firmware & protocol stacks
Bare-metal and RTOS firmware, bootloaders and signed updates, DALI-2 DT6/DT8 device stacks, cellular and GNSS drivers, BLE, low-power state machines, factory provisioning and checksum gating.
Mechanical & industrial design
Enclosure architecture, thermal paths, sealing and IP-rated potting or conformal coating options, cable glands and strain relief, sheet-metal and plastic parts with tooling reviews and tolerance studies.
Apps, cloud & fleet services
iOS and Android applications, device APIs, provisioning and identity, telemetry ingestion, remote configuration, fleet health dashboards and integration to a customer's PIM, ERP or BI stack.
Test engineering & automation
End-of-line test sequences written as automated scripts on real fixtures: hi-pot, power accuracy, protocol communication, dimming curves, colour points, RF and GNSS smoke tests, leak correlation and burn-in policy.
Compliance & certification engineering
Pre-compliance testing in-house, submission packages for protocol and safety certification, radio and telecom pathway screening, battery and packaging responsibility scopes, labelling review before first sale.
Engagement
Four gates from brief to build-ready
Each gate closes with written evidence. Nothing moves forward on a verbal "looks fine".
Gate 1 · Requirements
Scope freeze
- Use case, target environment, warranty terms
- Regulatory and certification scope per SKU
- Interface and interoperability matrix
- Product requirement document signed
Gate 2 · Design
Architecture review
- Block diagram, power budget, thermal model
- Firmware architecture and memory map
- Mechanical stack-up and sealing strategy
- Long-lead and single-source parts flagged
Gate 3 · Prototype
Working units
- Prototype builds on production-intent PCBs
- Interoperability proven on a real network
- Internal pre-compliance sweep
- DFM and DFT findings closed out
Gate 4 · Release
Engineering pack
- Frozen BOM, approved vendor list, drawings
- SOPs, jigs, fixtures and test sequences
- Certification plan and submission package
- Handover to pilot build
What you receive
The deliverables, itemised
- Schematic and PCB package — source files, gerbers, stencils, assembly drawings, test points declared.
- Firmware release set — versioned images, checksum manifest, provisioning tooling, debug symbols retained.
- Protocol evidence — interoperability results across reference controllers and third-party devices.
- Mechanical package — 3D models, 2D toleranced drawings, sealing and torque specifications, tooling drawings.
- Process package — station-level SOPs, jig and fixture definitions, workmanship standard references.
- Test package — end-of-line sequences, limits, fixture designs, burn-in policy and re-test rules.
- Certification package — submission files, sample quantities, lab bookings and a compliance matrix.
Questions
Commonly asked about development work
Yes. A common entry point is a completed design that has never been through a production review. We audit the schematic, layout, bill of materials and firmware, then deliver a DFM and DFT report with a costed list of changes needed to make it buildable, testable and certifiable. Where a design is already complete, we go straight to industrialisation.
Ownership follows the engagement: design-for-hire work transfers to the customer on final payment, including schematics, firmware source, mechanical models and tooling. Where Saiga Electronics contributes pre-existing platform IP — protocol stacks, reference power stages, test automation — the customer receives a perpetual licence to use it in the delivered product. Both positions are set in writing before work starts.
Firmware is checksum-gated at flashing and the version is recorded against every serial. Component changes go through an engineering-change lock: no substitution enters the bill of materials without a documented impact assessment and a re-test of the affected scope. A fielded batch therefore stays traceable to the exact build that produced it.
That is our preferred model. A single platform with power classes, interface options and enclosure variants shares one line, one test philosophy and one certification plan — the DALI-2 driver family spans five wattage classes on the same assembly flow. Multi-SKU changeover is labour hours and fixture swaps, not a re-launch.
A two to four week feasibility review: requirement clarification, regulatory pathway screening, a bill-of-materials and interoperability risk list, and a build plan with gates. It ends with a go or no-go decision made on evidence, before any tooling or long-lead commitment is placed.
Bring us the idea, the schematic, or the prototype
Send the requirement sheet and we will come back with a gated development plan, a certification path and a production timeline.